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SeniorOfficeSan Francisco

Physical Design Engineer

O
OpenAI
Уровень
Senior
Формат
Office
О роли

Описание вакансии

About the team

OpenAI's Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design.

About the role

We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time.

Responsibilities
  • Serve as the physical design SME for semiconductor customer engagements.
  • Partner with FDEs during customer discovery and scoping to translate ambiguous pain points into clear solution hypotheses, success criteria, and technical plans.
  • Support customer-facing technical conversations as a trusted advisor.
  • Help shape AI-assisted solutions across physical design workflows, including floorplanning, place and route, clocking, timing closure, congestion, power, physical verification, and signoff.
  • Guide feasibility and integration decisions across the entire chip design lifecycle.
  • Partner with FDEs and customer SMEs to curate evaluation datasets, golden tasks, rubrics, and acceptance criteria.
  • Build or guide lightweight prototypes, benchmarks, methodology experiments, and internal tools.
  • Educate and mentor the broader FDE team on physical design concepts, implementation flows, EDA tooling, and key trade-offs.
  • Surface repeated customer signal to Product and Research.
  • Progressively take on broader FDE responsibilities.
Requirements
  • BS with 7+ years, MS with 5+ years, or equivalent industry experience in physical design, physical implementation, or backend signoff for complex ASIC or SoC programs.
  • Demonstrated success bringing complex designs through tapeout, with hands-on experience in floorplanning, place and route, CTS, timing closure, power analysis, physical verification, and signoff.
  • Deep familiarity with industry-standard EDA tools and flows for synthesis, PNR, STA, physical verification, equivalence checking, and power analysis.
  • Strong understanding of how physical design intersects with microarchitecture, RTL, verification, design methodology, libraries/PDKs, and system-level PPA trade-offs.
  • Strong communication and collaboration skills.
  • Strong scripting and automation skills in Python, Tcl, or similar.
  • Excited to grow beyond domain SME responsibilities into a broader Forward Deployed Engineering role.
Preferred qualifications
  • Experience working across multiple semiconductor companies, design environments, or tool stacks.
  • Experience partnering with external customers, strategic accounts, or design partners in a technical advisory capacity.
  • Experience defining or scaling evaluation workflows, benchmarks, or acceptance criteria.
  • Exposure to adjacent workflows such as design and/or verification.
  • Experience applying AI/LLM systems to semiconductor workflows.
  • Prior experience in solutions engineering, field engineering, customer-facing technical delivery, or consultative technical roles.
Стек и навыки

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