Manufacturing Engineer

ICEYE delivers space-based intelligence, surveillance, and reconnaissance (ISR) capabilities to governments and allied nations. This includes sovereign and turnkey ISR missions leveraging ICEYE's world-leading synthetic aperture radar (SAR) satellite technology, as well as access to data from the world's largest SAR satellite constellation. ICEYE operates internationally with offices in Finland, Poland, Spain, Japan, the UAE, Greece, Germany, and the US. The company has more than 900 employees, inspired by the shared vision of improving life on Earth by becoming the global source of truth in Earth Observation.

• Review schematics and PCB layouts for manufacturability (stackups, routing, power integrity, grounding, impedance control).
• DFM/DFA reviews (panelization, drill sizes, annular rings, solder mask, copper balancing).
• Review manufacturer DFM reports, negotiate design changes with fabricators/assemblers.
• Own ECOs arising from manufacturing feedback.
• Manage PCB/PCBA documentation (Gerbers, ODB++, IPC-2581, BOMs, pick-and-place).
• Support test strategy (flying probe, ICT, boundary scan, functional test, AOI, X-ray).
• Apply IPC standards to defect/root cause/failure analysis.
• Evaluate component footprints/packages for assembly risk.
• Work with fab/SMT partners on soldering, stencil design, surface finishes.
• Manage PCB/PCBA supplier relationships (risk, issue tracking, scheduling).

• 3+ years of experience in manufacturing/process engineering within aerospace, defense, or another high-reliability industry.
• Degree in Manufacturing, Electrical, Industrial Engineering, or equivalent hands-on experience.
• PCB Design Review – Read schematics, review PCB layouts, understand multilayer stackups, evaluate routing, power integrity, grounding, impedance control.
• PCB Manufacturing (DFM) – Design for Manufacturability (DFM), Design for Assembly (DFA), panelization, fabrication constraints, drill sizes, annular rings, solder mask rules, copper balancing.
• PCB Quality – IPC standards (IPC-A-600, IPC-6012, IPC-610), defect analysis, root cause analysis, failure analysis.
• Manufacturing Communication – Review manufacturer DFM reports, answer engineering questions, negotiate design changes, manage engineering change orders (ECOs).
• CAD Tools – Any, but in particular Altium Designer.
• Documentation – Gerbers, ODB++, IPC-2581, fabrication drawings, assembly drawings, BOM management, pick-and-place files.
• Testing – Flying probe, ICT, boundary scan, functional testing, AOI, X-ray inspection.
• Component Knowledge – PCB footprints, package types, SMT, through-hole, BGA, fine-pitch components.
• Manufacturing Process – PCB fabrication, SMT assembly, reflow soldering, wave soldering, stencil design, PCB finishes (ENIG, HASL, OSP).
• Project Skills – Supplier management, risk assessment, issue tracking, schedule coordination.

• Hybrid working type.
• Employment is subject to applicable security screening (incl. SUPO, where required).