Key Responsibilities
- Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces.
- Perform advanced pre‑layout and post‑layout SI/PI analysis across PCBs, flex circuits, rigid‑flex assemblies, connectors, and advanced packages.
- Lead root‑cause analysis of challenging SI/PI issues such as margin shortfalls, impedance discontinuities, coupling, resonances, and simulation‑to‑hardware mismatches.
- Analyze and resolve SI/PI challenges associated with flex circuits, high‑speed flex connectors, interposers, and advanced packaging technologies.
- Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation to resolve performance and stability issues.
- Define and refine PCB, rigid‑flex, and flex circuit stack‑ups, material selections, and impedance structures as required to meet performance targets.
- Review schematics, PCB layouts, and flex designs to identify SI/PI risks and recommend targeted design changes.
- Work closely with silicon and package design teams to resolve SI/PI issues related to bump/ball assignments, package‑to‑PCB transitions, and interface interactions.
- Act as a technical escalation point for complex SI/PI issues across multiple programs.
Minimum Qualifications
- Master’s degree in Electrical Engineering.
- 15+ years of demonstrated depth of expertise in system-level signal integrity and power integrity engineering for high‑speed hardware systems.
Required Experience and Skills
- Deep expertise in high‑speed serial and parallel interface analysis and debug.
- Strong hands‑on experience with PCB, rigid‑flex, and flex circuit stack‑up design and analysis.
- Advanced SI/PI analysis of flex connectors, high‑density interconnects, and advanced packaging technologies.
- Proficiency with 2D and 3D electromagnetic simulation tools.
- Power delivery network analysis, simulation, and lab correlation at the system level.
- Strong grounding in transmission line theory, microwave engineering, and high‑speed design fundamentals.
- Proven ability to correlate simulation results with hardware behavior and drive concrete design fixes.
- Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, enterprise product, GPU, CPU, TPU, server platform etc.
Additional Information
- Experience with large‑scale AI or high-performance compute systems is preferred.