About the company
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.
Responsibilities
- Receive, inspect, and process returned merchandise according to established RMA procedures
- Conduct detailed failure analysis investigations to identify root causes of product defects
- Perform technical troubleshooting and testing on returned units using appropriate diagnostic tools and methodologies
- Document all findings, observations, and test results in comprehensive technical reports
- Analyze failure patterns and trends to identify systemic issues and areas for improvement
- Collaborate with quality assurance, engineering, and manufacturing teams to develop and implement corrective actions
- Maintain organized and accurate RMA documentation, databases, and tracking systems
- Prepare detailed technical reports and failure analysis summaries for management and stakeholder review
- Communicate findings and recommendations to internal teams and external customers as needed
- Ensure compliance with company policies, quality standards, and regulatory requirements throughout the RMA process
Requirements
- Proven experience in failure analysis, RMA processing, or ASIC quality engineering
- Strong technical troubleshooting and problem-solving skills
- Proficiency in root cause analysis (RCA) methodologies and techniques
- Excellent attention to detail and organizational abilities
- Solid understanding of product quality standards and quality management systems
- Proficiency in technical documentation and report writing
- Strong analytical and data interpretation skills
- Experience with RMA management systems or similar software platforms
- Knowledge of electronics, manufacturing processes, or relevant product domain
- Excellent communication and interpersonal skills
- Ability to work independently and collaboratively in a team environment
- Proficiency in Microsoft Office applications and AI data analysis tools
- Physical Failure Analysis (pFA) techniques: Decapsulation, Cross-section analysis, FIB (Focused Ion Beam), OBIRCH / emission analysis, Hotspot localization, Package-level failure investigation